The international exhibition on plastics and rubber industries, CHINAPLAS 2026, will be held from April 21 to 24, 2026, at the National Exhibition and Convention Center (NECC) in Shanghai, China. Under the theme "Transformation · Collaboration · Sustainability," the event will span over 390,000 square meters and gather more than 4,600 exhibitors worldwide to showcase the latest initiatives in advanced materials, smart manufacturing, and environmental sustainability.
Highlighted Materials for New Energy Vehicles and Aerospace
At CHINAPLAS 2026, material technologies for emerging industries such as New Energy Vehicles (NEVs), the Low-Altitude Economy (LAE), aerospace, and humanoid robotics will be a primary focus.
In the NEV sector, which recorded a production volume of 16.6 million units and sales of 16.5 million units in 2025, material solutions for batteries, charging infrastructure, and drive systems are emerging. The exhibition will feature Rianlon’s advanced polymer antioxidants for battery systems and DOMO’s "TECHNYL PURE" engineering plastics for high-voltage environments.
Photo courtesy of CHINAPLAS
For the LAE, including electric Vertical Take-off and Landing (eVTOL) aircraft, exhibits will feature Covestro’s high-CTI polycarbonate (PC) and Kingfa’s flame-retardant composite panels, which can withstand 1,200°C for 30 minutes and self-extinguish within 10 seconds of flame removal.
In the aerospace sector, Syensqo's "MTM46" epoxy resin system for extreme environments, which achieves approximately a 30% weight reduction compared to metals, will be highlighted. Also featured are PEEK and PEKK, which offer excellent high-temperature, radiation, and chemical resistance for satellite structural components, cable insulation, and engine seals; phenolic resins with high char yield and excellent processability for commercial solid rocket nozzles; and Liquid Crystal Polymers (LCP), a key material for high-frequency satellite communication components due to its low dielectric constant, low dielectric loss, and excellent high-temperature performance.
Photo courtesy of CHINAPLAS
Regarding the robotics sector, China's domestic spending exceeded USD 1.4 billion in 2025. In addition to PEEK and PPS, which replace metal parts in robot joints, gears, and bearings, materials for artificial muscles will be introduced. These include Lushan New Materials’ bimodal electronic skin and Dawn Group’s ultra-soft TPE (Thermoplastic Elastomers) with a Shore hardness of 0A, suitable for core components like robotic joint actuators.
Photo courtesy of CHINAPLAS
Smart Manufacturing via AI Technology
The integration of AI in manufacturing processes is also a major theme at CHINAPLAS 2026. Good Vision & Motion will demonstrate a high-speed quality inspection system that integrates AI algorithms to complete product evaluations in milliseconds. Jeenar will present an AI valve-bag inspection system that detects defects during production, and ENGEL will showcase "injectAI," an AI-equipped process monitoring system that automatically analyzes over 1,000 parameters in real-time to identify production deviations.
Environmental Sustainability and the Circular Economy
Initiatives toward a circular economy for plastics, including recycling technologies and bio-based materials, are drawing significant attention.
BASF, in collaboration with Porsche and BSR, will display the results of a project that uses gasification technology to convert mixed waste—such as plastics and foams recovered from end-of-life vehicles—into syngas and derivatives, reusing them as polyurethane raw materials for new steering wheels. Boretech will introduce chemical recycling systems using glycolysis, microwave alcoholysis, and solvent processes for PET, PP, PE, and composite or dyed plastics.
Photo courtesy of CHINAPLAS
CHINAPLAS 2026, held in the first year of China's "15th Five-Year Plan," is currently accepting pre-registrations. Admission tickets are priced at USD 7.5.
Meet Your Strategic Partner: Kanamori Sangyo at CHINAPLAS 2026
As the plastics and rubber industries stand at the crossroads of a technological revolution, Kanamori Sangyo Co., Ltd. is proud to participate in CHINAPLAS 2026 to help you navigate these complex changes. Beyond being a specialized chemical trading company, we position ourselves as your strategic partner, bridging the gap between cutting-edge material science and your specific manufacturing challenges.
Inspired by the themes of "Transformation, Collaboration, and Sustainability," our exhibit this year focuses on high-performance solutions that address the rigorous demands of the New Energy Vehicle (NEV) and aerospace sectors highlighted in this report. We invite you to explore our curated selection of advanced materials, featuring two of our primary focus areas for 2026:
Next-Generation Lightweight Composites: To support the "Low-Altitude Economy" and NEV range extension, we are showcasing reinforced thermoplastic composites that offer exceptional strength-to-weight ratios, designed to replace traditional metal components in structural applications.
High-Performance Biomass-Derived Plastics: Supporting the circular economy, our new line of bio-based engineering plastics provides heat resistance and mechanical properties comparable to petroleum-based grades, offering a seamless transition to carbon neutrality without compromising quality.
At the Kanamori Sangyo booth, our technical experts will be available to provide personalized consultations. Whether you are struggling with thermal management in high-voltage environments or seeking to integrate recycled content into high-precision components, we offer the global procurement network and technical insights necessary to accelerate your innovation.
Don’t miss the opportunity to transform your supply chain and product performance. We look forward to welcoming you to our booth in Shanghai!
Schedule an Appointment
To ensure a dedicated time with our technical consultants during the exhibition, we recommend booking a meeting in advance. Please click the button below to access our inquiry form and share your interests with us.